Compute Pack V1
First-generation ruggedized edge compute platform for the tactical edge
Overview
I led the development of Ravn's first ruggedized edge computing platform from concept to contract delivery. As the technical architect and lead engineer, I owned the entire electromechanical system design, from defining requirements and selecting the SOM to managing the electrical and firmware development efforts.
I provided the mechanical design for all parts, sized the integrated heatsink with basic FEA analysis and worked closely with vendors to manufacture the parts. I created and managed the full BOM and procurement for every component.
To solve an obscure noise issue on the USB lines which caused intermittent communication with some devices, I designed (schematics, layout and routing), assembled and installed a custom USB hub daughter card into each Compute Pack V1.
I personally assembled 70 Compute Pack V1 units, delivering 20 pre-production devices as part of a SOCOM contract. I led hardware integration with PRC-163 and Silvus radios, including custom cable specs and rugged enclosure design.
Internals of the Compute Pack V1. The SOM is loaded on the back of the PCB shown so that it can be in contact with the integrated heatsink.
Pre-production of Compute Pack V1.
Dock for the Compute Pack V1. Learn more here
Full system testing.
Early integration work with the PRC-163.
Example loadout for user with a Silvus radio.
The USB hub daughter card I designed to solve the noise issue.
Compute Pack V1 being delivered as part of a SOCOM contract.
Compute Pack V1 being delivered as part of a different SOCOM contract. Learn more here
Accomplishments
- ✓Architected the complete electromechanical system, including SOM selection and thermal solution.
- ✓Steered the project away from a chip-down design toward a SOM solution to save development time and cost.
- ✓Implemented the Nett Warrior specification for device connectors.
- ✓Delivered 21 production units for SOCOM contracts.
- ✓Personally assembled 70 units for development and contract delivery.
Lessons Learned
- •Reliably sealing an enclosure with a complex parting line is difficult.
- •A device can be below its maximum thermal rating and still be uncomfortable to touch.
- •Sales engineers often know less about their products than you can learn through simple testing.
- •Switching to a SOM instead of chip-down can dramatically cut development time and risk.
- •Digital signals can be very noisy and hard to debug.